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深圳市高创鑫电子科技有限公司
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HVC142AKRF-E RENESAS 丝印T6
• An optimal solution for antenna switching in mobile phones.
• Low capacitance. (C = 0.35 pF max)
• Low forward resistance. (rf = 1.3 Ω max)
• Ultra small Flat Lead Package (UFP) is suitable for surface mount design.
Reverse voltage VR: 30 V
Forward current IF: 100 mA
Power dissipation Pd: 150 mW
Junction temperature Tj: 125 °C
Storage temperature Tstg:−55 to +125 °C
• An optimal solution for antenna switching in mobile phones.
• Low capacitance. (C = 0.35 pF max)
• Low forward resistance. (rf = 1.3 Ω max)
• Ultra small Flat Lead Package (UFP) is suitable for surface mount design.
Reverse voltage VR: 30 V
Forward current IF: 100 mA
Power dissipation Pd: 150 mW
Junction temperature Tj: 125 °C
Storage temperature Tstg:−55 to +125 °C